发明名称 Automatic place and route method for electromigration tolerant power distribution
摘要 The present disclosure relates to an electromigration tolerant power distribution network generated by an automatic place and route (APR) methodology. In some embodiments, an automatic place and route tool constructs a local power network having multi-level power rails. The multi-level power rails have interleaved segments of vertically adjacent metal layers, wherein each interleaved segment is shorter than a predetermined characteristic length corresponding to a Blech length. By limiting the length of the interleaved metallization segments, electromigration within the multi-level power rails is alleviated, allowing for the maximum current density requirement (Jmax) for mean time to failures (MTTF) to be increased.
申请公布号 US8694945(B2) 申请公布日期 2014.04.08
申请号 US201113331329 申请日期 2011.12.20
申请人 WANG CHUNG-HSING;TAM KING-HO;CHEN HUANG-YU;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 WANG CHUNG-HSING;TAM KING-HO;CHEN HUANG-YU
分类号 G06F17/50;H01L23/498 主分类号 G06F17/50
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