发明名称 |
Automatic place and route method for electromigration tolerant power distribution |
摘要 |
The present disclosure relates to an electromigration tolerant power distribution network generated by an automatic place and route (APR) methodology. In some embodiments, an automatic place and route tool constructs a local power network having multi-level power rails. The multi-level power rails have interleaved segments of vertically adjacent metal layers, wherein each interleaved segment is shorter than a predetermined characteristic length corresponding to a Blech length. By limiting the length of the interleaved metallization segments, electromigration within the multi-level power rails is alleviated, allowing for the maximum current density requirement (Jmax) for mean time to failures (MTTF) to be increased. |
申请公布号 |
US8694945(B2) |
申请公布日期 |
2014.04.08 |
申请号 |
US201113331329 |
申请日期 |
2011.12.20 |
申请人 |
WANG CHUNG-HSING;TAM KING-HO;CHEN HUANG-YU;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
WANG CHUNG-HSING;TAM KING-HO;CHEN HUANG-YU |
分类号 |
G06F17/50;H01L23/498 |
主分类号 |
G06F17/50 |
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