| 摘要 |
Provided is a heat radiation circuit board mounted on a chassis having a light guide path of a backlight unit. The heat radiation circuit board integrated with a blanket includes a first region on which a light emitting device is mounted and a second region which is bent with the first region. The second region includes a plurality of heat radiation patterns. Therefore, heat radiation properties are improved by enlarging a heat radiation region by forming a pattern on the upper or lower side of the heat radiation region on the heat radiation circuit board. |
