| 摘要 |
The present invention relates to an automatic flatness controllable bonding tool, which is a bonding tool bonding electronic components to a panel and capable of automatically controlling flatness of a bonding head tip by directly pressurizing and bonding the electronic components, and an automatic flatness control method thereof. More specifically, the present invention relates to an automatic flatness controllable bonding tool and an automatic flatness control method thereof, wherein the automatic flatness controllable bonding tool includes a bond head having the bonding head tip; and an automatic flatness control part fixated to an upper surface of the bonding head to control the flatness of the bonding head. When the automatic flatness control part causes the bonding head tip to touch an upper surface of a backup tool in order to control flatness of the bonding head, the automatic flatness control part automatically controls the bonding head so that the bonding head remains to be horizontal to the upper surface of the backup tool, thereby enabling high-accuracy flatness control of the bonding head, simply performing the flatness control, and minimizing a flatness control time of the bonding head. |
