Stopper of magazine for semiconductor package and methods for manufacturing a stopper

摘要

PURPOSE: A stopper of a magazine for a semiconductor package and a processing method thereof are provided to reduce manufacturing time and costs by processing the stopper with a forging method after a metal bar of a circular section is bent. CONSTITUTION: A metal bar (100) of a circular section is regularly cut. Both ends of the cut metal bar are symmetrically bent to form a vertical part (110) and a parallel part (120). The vertical part is vertically formed in the axial direction of the metal bar. A taper surface (111) is formed by forging one vertical part of the bent metal bar. The taper surface becomes wider toward the parallel part. A resin layer is formed on the surface of the vertical part.