| 摘要 |
The present invention provides a flexible copper-clad laminate having a folding resistance property, capable of preventing a wire circuit from being disconnected or cracked in a narrow housing. The flexible copper-clad laminate according to the present invention is a flexible copper-clad laminate, in which a copper plate (B) having a thickness of 8-20μm, a tensile modulus of 10-20 Gpa, and having an average crystalline particle diameter of at least 10μm in a section taken in a thickness direction is provided at least one surface of a polyimide layer (A) having a thickness of 10-25μm and a tensile modulus of 4-10 Gpa, folded and received in a housing of an electronic device. A folding coefficient calculated through following Equation (I) is in the range of 0.96±0.02 in a bending test in which a gap of a predetermined flexible substrate having a copper wire formed by machining the copper plate of the flexible copper-clad laminate is 0.3 mm. Equation 1 is expressed as [PF]=(¦ε¦-ε_c)/¦ε¦, wherein¦ε¦is an absolute value of an average distortion value of the bent copper wire, andε_c represents the distortion of the tensile elastic limit of the copper wire. |
