发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE AND RECORDING MEDIUM
摘要 The purpose of the present invention is to provide a semiconductor device manufacturing method capable of forming a carbon based layer having a proper property in a temperature region of 700°C or less, a substrate processing method, a substrate processing device, and a recording medium. A layer which has a carbon layer on the substrate is formed by repeating a cycle several times which includes a process of supplying an organic gas into a process room and sealing the organic gas in the process room in a state of heating a substrate received in the process room, a process of maintaining a state of sealing the organic gas in the process room, and a process of discharging the organic gas in the process room.
申请公布号 KR20140041661(A) 申请公布日期 2014.04.04
申请号 KR20140030159 申请日期 2014.03.14
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 TAKEDA TSUYOSHI;SATO TAKETOSHI;KOHASHI MINORU
分类号 H01L21/31;H01L21/205 主分类号 H01L21/31
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