| 摘要 |
The present invention relates to a bending device in a mounting system of a release mounter and, more particularly, to a bending device in a mounting system of a release mounter capable of sufficiently generating a large force to bend a thick leg part of a component like a Mylar condenser and reducing a size thereof by using a small cylinder using the principle of the lever when the leg part is bent for laying and attaching a release component to reduce the thickness of a PCB for picking up and locating the release component to solder the leg part of a release electronic component like a diode, a chip, and a condenser on the PCB. |
