发明名称 |
FLEXIBLE CIRCUIT CLAD LAMINATE, PRINTED CIRCUIT BOARD USING IT, AND METHOD OF MANUFACTURING THE SAME |
摘要 |
The purpose of the present invention is to provide a flexible circuit copper-clad laminate with excellent etching characteristics, peel strength, and curl characteristics. The flexible circuit copper-clad laminate according to the present invention includes a polymer film, a tie-coat layer formed on at least one surface of the polymer film, and a copper (Cu) layer formed on the tie-coat layer. The tie-coat layer is composed of an alloy containing 10.0-70.0 wt% of molybdenum (Mo), 0.5-20.0 wt% of iron (Fe), and a remaining part of nickel (Ni). |
申请公布号 |
KR20140041084(A) |
申请公布日期 |
2014.04.04 |
申请号 |
KR20120108016 |
申请日期 |
2012.09.27 |
申请人 |
LS MTRON LTD. |
发明人 |
BANG, SUNG HWAN;KIM, KYUNG KAK;CHOI, SUNG HOON;JUNG, HO YOUNG;KIM, TAE HYUN;OH, WON KEUN |
分类号 |
B32B15/08;H05K1/03;H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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