| 摘要 |
Disclosed are: a photocurable heat-curable resin composition which enables the formation of a cured coating film having PCT resistance, HAST resistance, electroless gold plating resistance and thermal shock resistance which are important properties required for solder resists for semiconductor packages; a dried film produced from the composition and a cured product of the composition; and a printed wiring board having, formed thereon, a cured coating film (e.g., a solder resist) comprising the dried film or the cured product. Specifically disclosed is a photocurable heat-curable resin composition which can be developed with an aqueous alkaline solution, which comprises a resin containing a carboxyl group, a photopolymerization initiator, an elastomer containing a vinyl group, and a mercapto compound. Preferably, the resin containing a carboxyl group is not derived from an epoxy resin. |
