JIG FOR PERFORMANCE TESTING MACHINE OF SEMICONDUCTOR PACKAGE

摘要

Disclosed is a jig for a performance tester of a semiconductor package, including: a body provided with a guide section; a mounting stand disposed on the guide section to be able to slide and on which the semiconductor package is mounted; and a pin block disposed on an external side of the mounting stand to be able to slide in the guide section and having a plurality of pins connected to a connection pin which is mounted on the semiconductor package.