SUBSTRATE PROCESSING APPARATUS, LID AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

The present invention provides a substrate processing device capable of reacting to the variation of processing time at each processing area in the substrate processing device comprising a plurality of processing areas. The substrate processing device comprises: a substrate mounting part capable of mounting a plurality of substrates in a circumference shape by being mounted on a processing chamber; rotating equipment to rotate the substrate mounting part at a specific angular velocity; a separation structure to separate the processing chamber by being radially installed from the center of the object of the processing chamber; and gas supplying areas respectively disposed at the spaces between the adjacent separation structures wherein the angle formed by the adjacent separation structure by disposing one of the gas supplying areas corresponding to the angular velocity and the time for a part of the substrate mounting parts to pass the gas supplying area. [Reference numerals] (AA) Region A (1 second/150째); (BB) Region D (0.4 second/60째); (CC) Region C (0.2 second/30째); (DD) Region B (0.8 second/120째)