| 摘要 |
The present invention is a semiconductor package with an electromagnetic shielding structure which protects the individual elements inside the package from impact, and at the same time, has excellent electromagnetic interference (EMI) or electromagnetic susceptibility (EMS) properties. In order to achieve this, the semiconductor package, according to the present configuration, comprises four main components: a substrate on which a ground electrode is formed; at least one electronic component which is mounted on top of the substrate; an insulating mold unit, which is formed into a cap, is attached to the top of the substrate and has an empty space inside, which holds the electronic component and is fixed to the substrate in order to expose at least a portion of the ground electrode to the outside; and a conductive shield unit which adheres to and covers the outer surface of the mold unit, and is electrically connected to the part of the ground electrode exposed to the outside of the mold unit. |
