| 摘要 |
PROBLEM TO BE SOLVED: To reduce the failure by reducing stress on a lead pin (terminal) when mounting an electronic component having the lead pin (terminal), and to reduce the mounting surface of a substrate and insert the terminal easily into a through hole by eliminating the need for a forming step for bending and widening the lead pin (terminal).SOLUTION: In an electronic component mounting substrate for mounting an electronic component having a plurality of lead pins 101 on a printed circuit board 110, the printed circuit board 110 is provided corresponding to the plurality of lead pins 101, respectively, and has a plurality of through holes 120a, 120b for passing the plurality of lead pins 101, respectively. Out of the plurality of through holes, corresponding to the plurality of lead pins 101, respectively, at least one through hole has a size larger than the size of other through holes. |
