发明名称 |
PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES |
摘要 |
A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages. |
申请公布号 |
WO2014052273(A1) |
申请公布日期 |
2014.04.03 |
申请号 |
WO2013US61316 |
申请日期 |
2013.09.24 |
申请人 |
APPLE INC. |
发明人 |
ZHAO, JIE-HUA;YANG, YIZHANG;ZHAI, JUN;CHUNG, CHIH-MING |
分类号 |
H01L25/10;H01L25/00 |
主分类号 |
H01L25/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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