发明名称 LED ELEMENT AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To achieve an LED element which prevents the occurrence of cracks and peeling at a layer interface at the time of manufacturing while ensuring propagation of current flowing through the luminous layer in a horizontal direction and achieving high luminous efficiency.SOLUTION: An LED element comprises: a conductive layer 20 formed in an upper layer of a support substrate 11; a conductive oxide film layer 38 which is formed in an upper layer of the conductive layer 20 and formed from a material having a thermal expansion coefficient of not less than 1×10/K and not more than 1×10/K; a first semiconductor layer 32 which is formed in a manner such that a bottom face contacts a part of a top face of the conductive layer 20 and a part of a top face of the conductive oxide film layer 38 and which is formed from a p-type semiconductor; a second semiconductor layer 31 which is formed on an upper layer of the first semiconductor layer 32 and formed from a p-type semiconductor having a lower concentration than the first semiconductor layer 32; a luminous layer 33 formed in an upper layer of the second semiconductor layer 31; a third semiconductor layer 35 which is formed on an upper layer of the luminous layer 33 and formed from an n-type semiconductor; and an electrode 42 formed at a position opposite to the conductive oxide film layer 38 in a vertical direction in a manner such that a bottom face contacts a part of a top face of the third semiconductor layer 35.
申请公布号 JP2014060294(A) 申请公布日期 2014.04.03
申请号 JP20120204924 申请日期 2012.09.18
申请人 USHIO INC 发明人 MIYOSHI KOHEI;TSUKIHARA MASASHI
分类号 H01L33/38;H01L33/32 主分类号 H01L33/38
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