发明名称 METHOD FOR FORMING PATTERN
摘要 Provided are: a device and method for reducing sagging of a pattern side wall part occurring when printing a wiring or electrode pattern using a screen printing method involving a conductive paste, an insulating paste, or a semiconductor paste; reducing mesh marks on the wiring or electrode pattern or on a full surface mat film; and manufacturing high-quality electronic components; and a pattern forming method in which screen printing can be used, the pattern forming method allowing double-sided printing to be conducted with fewer steps than a conventional method. A screen printing method is used to print, with the use of a conductive paste, an insulating paste, or a semiconductor paste, a pattern on a blanket having a surface comprising polydimethylsiloxane. The pattern is formed by being transferred from the blanket onto an object to be printed upon.
申请公布号 WO2014050560(A1) 申请公布日期 2014.04.03
申请号 WO2013JP74551 申请日期 2013.09.11
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCEAND TECHNOLOGY 发明人 NOMURA KENICHI;USHIJIMA HIROBUMI;IWASE NORIKO;YOSHIDA MANABU
分类号 H01B13/00;C09D11/00;H01G4/12;H01G4/30;H01G13/00;H05K3/20 主分类号 H01B13/00
代理机构 代理人
主权项
地址