发明名称 |
Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP |
摘要 |
A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A portion of the insulating layer is removed by LDA to expose a portion of an active surface of the semiconductor die. A first conductive layer is formed over a contact pad on the active surface of the semiconductor die. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is disposed over a carrier with the active surface of the semiconductor die offset from the carrier. An encapsulant is deposited over the semiconductor die and carrier to cover a side of the semiconductor die and the exposed portion of the active surface. An interconnect structure is formed over the first conductive layer. Alternatively, a MUF material is deposited over a side of the semiconductor die and the exposed portion of the active surface. |
申请公布号 |
US2014091482(A1) |
申请公布日期 |
2014.04.03 |
申请号 |
US201313832809 |
申请日期 |
2013.03.15 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
LIN YAOJIAN;WIRTZ HEINZ-PETER;YOON SEUNG WOOK;MARIMUTHU PANDI C. |
分类号 |
H01L23/28;H01L21/56;H01L21/78 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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