| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component mounting method of high productivity, by relaxing the upper limit of component size of interfering components in adjoining suction nozzles, when taking out an electronic component by rotating a plurality of suction nozzles.SOLUTION: In an electronic component mounting device or an electronic component mounting method for taking out an electronic component by means of a plurality of suction nozzles arranged on a circle, and then mounting the electronic component on a printed circuit board, the electronic component is supplied, and a suction nozzle at a position, where the feeding direction of a feeder is parallel with a line connecting the center of rotation of a mounting head 5 and a suction nozzle to be taken out, is rotated by an angle different from the angle at that position, before the electronic component is taken out by means of the suction nozzle. |
