发明名称 LIQUID-COOLED HEAT DISSIPATING DEVICE AND METHOD OF MAKING THE SAME
摘要 A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.
申请公布号 US2014090825(A1) 申请公布日期 2014.04.03
申请号 US201314077430 申请日期 2013.11.12
申请人 TONG HSING ELECTRONIC INDUSTRIES, LTD. 发明人 CHIANG WEN-CHUNG
分类号 F28F3/12 主分类号 F28F3/12
代理机构 代理人
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