<p>A method for processing a semiconductor assembly is presented. The method includes: (a) contacting at least a portion of a semiconductor assembly with a chalcogen source, wherein the semiconductor assembly comprises a semiconductor layer comprising a semiconductor material disposed on a support; (b) introducing a chalcogen from the chalcogen source into at least a portion of the semiconductor material; and (c) disposing a window layer on the semiconductor layer after the step (b).</p>
申请公布号
WO2014052515(A1)
申请公布日期
2014.04.03
申请号
WO2013US61793
申请日期
2013.09.26
申请人
FIRST SOLAR MALAYSIA SDN. BHD.;KOREVAAR, BASTIAAN ARIE;AHMAD, FAISAL RAZI