发明名称 |
METHOD OF CONVEYING HEAT FROM A LIGHT EMITTING DIODE ASSEMBLY |
摘要 |
A method of conveying heat from a light emitting diode assembly. The method includes providing a light emitting diode assembly having a body that has a substrate with driving circuitry and a plurality of light emitting diodes that produce heat that is conveyed to a heat transfer element. The heat transfer element has a continuously engaged interface with the ceiling of a dwelling when secured. In this manner heat is conveyed from the heat transfer element to the ceiling of the dwelling to dissipate heat from the assembly, thus presenting a light emitting diode assembly with a low profile. |
申请公布号 |
WO2014052897(A1) |
申请公布日期 |
2014.04.03 |
申请号 |
WO2013US62414 |
申请日期 |
2013.09.27 |
申请人 |
GRAJCAR, ZDENKO;LILLY, JOHN |
发明人 |
GRAJCAR, ZDENKO;LILLY, JOHN |
分类号 |
F21V29/00 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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