发明名称 METHOD OF CONVEYING HEAT FROM A LIGHT EMITTING DIODE ASSEMBLY
摘要 A method of conveying heat from a light emitting diode assembly. The method includes providing a light emitting diode assembly having a body that has a substrate with driving circuitry and a plurality of light emitting diodes that produce heat that is conveyed to a heat transfer element. The heat transfer element has a continuously engaged interface with the ceiling of a dwelling when secured. In this manner heat is conveyed from the heat transfer element to the ceiling of the dwelling to dissipate heat from the assembly, thus presenting a light emitting diode assembly with a low profile.
申请公布号 WO2014052897(A1) 申请公布日期 2014.04.03
申请号 WO2013US62414 申请日期 2013.09.27
申请人 GRAJCAR, ZDENKO;LILLY, JOHN 发明人 GRAJCAR, ZDENKO;LILLY, JOHN
分类号 F21V29/00 主分类号 F21V29/00
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