METHOD FOR PRODUCING MULTILAYER SUBSTRATE, MULTILAYER INSULATING FILM, AND MULTILAYER SUBSTRATE

摘要

Provided is a multilayer insulating film into which a groove having a predetermined depth can be formed with high accuracy. A method for producing a multilayer substrate according to the present invention uses a multilayer insulating film (1) which comprises a first insulating layer (2) and a second insulating layer (3) that is laminated on one surface of the first insulating layer (2), said second insulating layer (3) being configured such that only the second insulating layer (3) is selectively removed among the first insulating layer (2) and the second insulating layer (3) when the second insulating layer (3) is partially removed, so that the resulting insulating layer can be provided with a groove that has a depth equal to the thickness of the second insulating layer (3). This method for producing a multilayer substrate comprises: a step wherein the multilayer insulating film (1) is laminated on the surface of a circuit board; a step wherein the second insulating layer (3) is partially removed in such a manner that only the second insulating layer (3) is selectively removed among the first insulating layer (2) and the second insulating layer (3), so that the resulting insulating layer is provided with a groove that has a depth equal to the thickness of the second insulating layer (3); and a step wherein a metal wiring line is formed in the groove that has been formed in the insulating layer.