| 摘要 |
<p>A multilayer wiring board (1) comprising a middle wiring layer (10) disposed in the middle of an odd number of wiring layers, insulating layers (11, 13, 15, 17) and wiring layers (12, 14, 16, 18) disposed respectively above and below the middle wiring layer (10), and layer-to-layer connectors (20, 21) having a trapezoidal shape in cross section and passing through the insulating layers (11, 13) to connect the wiring layers (10, 12, 14) together. The layer-to-layer connectors (20) are disposed so as to connect below the middle wiring layer (10), the layer-to-layer connectors (21) are disposed so as to connect above the middle wiring layer (10), and the tapers of the cross-sectional trapezoidal shapes of the layer-to-layer connectors (20, 21) are oriented in the same direction.</p> |
