| 摘要 |
Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal material (10) for electronic components, which is provided with: a base (11); a layer A (14) that constitutes the outermost layer of the base (11) and is formed of Sn, In or an alloy of these elements; and a layer B (13) that is arranged between the base (11) and the layer A (14) so as to constitute an intermediate layer and is formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy of these elements. The outermost layer (the layer A (14)) has a thickness of 0.002-0.2 μm, and the intermediate layer (the layer B (13)) has a thickness of 0.001-0.3 μm. |
