发明名称 TRANSFER TRAY
摘要 PROBLEM TO BE SOLVED: To provide a transfer tray with a simple structure which is advantageous to temperature control of a substrate.SOLUTION: A transfer tray T which holds a substrate S to be processed and is transferred to a vacuum processing device is constituted by temporarily attaching a sheet material 2, which includes through-holes 21 facing gas holes 12 and smaller than an outer shape of the substrate, on a tray body 1 in which electrodes 11 for electrostatic attraction are incorporated and the gas holes 12 for gas supply are opened. In the transfer tray T, the substrate is placed on an upper surface of the sheet material so as to cover the through-holes. The sheet material is closely adhered to the tray body and a lower surface peripheral edge of the substrate is closely adhered to the sheet material, when voltage is applied to the electrodes and the substrate is electrostatically attracted, so that gas reservoir spaces G are demarcated by a lower surface of the substrate and the through-holes on the upper surface of the tray body.
申请公布号 JP2014060242(A) 申请公布日期 2014.04.03
申请号 JP20120203908 申请日期 2012.09.18
申请人 ULVAC JAPAN LTD 发明人 MORIGUCHI NAOKI;KAMIMURA RYUICHIRO;AIHARA TSUTOMU
分类号 H01L21/683;B23Q3/15;H01L21/673 主分类号 H01L21/683
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