发明名称 |
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A package includes a semiconductor device including an active surface having a contact pad. A redistribution layer (RDL) structure includes a first post-passivation interconnection (PPI) line electrically connected to the contact pad and extending on the active surface of the semiconductor device. An under-bump metallurgy (UBM) layer is formed over and electrically connected to the first PPI line. A seal ring structure extends around the upper periphery of the semiconductor device. The seal ring structure includes a seal layer extending on the same level as at least one of the first PPI line and the UBM layer. |
申请公布号 |
US2014091437(A1) |
申请公布日期 |
2014.04.03 |
申请号 |
US201314100104 |
申请日期 |
2013.12.09 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YANG CHUNG-YING;CHEN HSIEN-WEI;YU TSUNG-YUAN;LIANG SHIH-WEI |
分类号 |
H01L23/528;H01L21/768 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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