发明名称 |
CONTROLLED SOLDER HEIGHT PACKAGES AND ASSEMBLY PROCESSES |
摘要 |
An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed. |
申请公布号 |
US2014091457(A1) |
申请公布日期 |
2014.04.03 |
申请号 |
US201213631939 |
申请日期 |
2012.09.29 |
申请人 |
JIANG HONGJIN;NALLANI ARUN KUMAR C.;TAN WEI |
发明人 |
JIANG HONGJIN;NALLANI ARUN KUMAR C.;TAN WEI |
分类号 |
H01L23/498;H01L21/48;H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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