发明名称 COMPOSITION FOR FORMING CONDUCTIVE FILM AND METHOD FOR PRODUCING CONDUCTIVE FILM
摘要 <p>The purpose of the present invention is to provide: a composition for forming a conductive film, which is capable of forming a conductive film that exhibits excellent adhesion to a base, while having excellent conductivity; and a method for producing a conductive film, which uses this composition. A composition for forming a conductive film of the present invention contains a copper-containing polymer, copper metal particles and/or copper oxide particles, and a solvent. The copper-containing polymer contains a copper ion and/or a copper salt, and a polymer which has a functional group that is interactive with the copper ion or the copper salt. The copper ion or the copper salt is connected to the polymer via the functional group, and the functional group contains at least one group that is selected from the group consisting of an amino group, an amide group, a pyridyl group, a hydroxyl group and a carboxyl group.</p>
申请公布号 WO2014050539(A1) 申请公布日期 2014.04.03
申请号 WO2013JP74355 申请日期 2013.09.10
申请人 FUJIFILM CORPORATION 发明人 TSUYAMA HIROAKI;KANO TAKEYOSHI
分类号 H01B1/22;H01B13/00;H05K1/09 主分类号 H01B1/22
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