| 摘要 |
To provide a semiconductor device having a high efficiency of arranging a TSV, there is provided a semiconductor device which is stacked with a semiconductor chip, and in which the semiconductor chips contiguous each other are electrically connected by plural TSVs, the semiconductor chip includes a core circuit and plural IO circuits arranged at a surrounding thereof, the TSV is arranged in the core circuit, and a pitch of arranging the TSVs is an integer-told of a ceil pitch of a library configuring the core circuit. |
