| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic laminate cutting method capable of accurately cutting the ceramic laminate, a ceramic laminate cutting device used in the method, and a method of manufacturing a laminated ceramic electronic component.SOLUTION: A ceramic laminate 1 is positioned by making a positioning guide 5 abut on a region in a reference surface 11 formed in the ceramic laminate 1, ranging from the side end of a force-cutting starting main surface 1a forming a main surface into which a force-cutting blade 3 is inserted when forming the reference surface to 1/2 thickness in the thickness direction of the ceramic laminate, and with the ceramic laminate held at a prescribed position, the force-cutting blade 3 is inserted into the ceramic laminate from either one of the main surfaces thereof to force-cut the laminate in the thickness direction. When a ceramic layer 24 for protection is disposed on the force-cutting starting main surface 1a side of an effective layer part 23 of the ceramic laminate, the positioning guide is made to abut on the ceramic layer 24 (24a) for protection that is disposed on the force-cutting starting main surface 1a side. |
