DICING-DIE BONDING TAPE AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP WITH ADHESIVE LAYER

摘要

PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape which can improve a pickup property of a semiconductor chip with an adhesive layer.SOLUTION: A dicing-die bonding tape 1 according to the present embodiment comprises: an adhesive layer 3; a non-adhesive layer 4 which is laminated on one surface of the adhesive layer 3 and has non-adhesion; an intermediate film 6 laminated on the non-adhesion layer 4 on a surface opposite to the adhesive layer 3 side; and a dicing layer 5 laminated on the intermediate film 6 on a surface opposite to the non-adhesive layer 4 side. A peel force between the non-adhesive layer 4 and the intermediate film 6 is 1 N/25 mm and over.