发明名称 |
SEMICONDUCTOR ELEMENT AND MOUNTING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element equipped with a conductive plate for achieving electrical connection with an element electrode and an external electrode on a substrate side simply and with high accuracy.SOLUTION: A semiconductor element comprises: an element body 12; an element electrode 13 provided on an undersurface of the element body 12; and a conductive plate 14 joined to the element electrode 13. The conductive plate 14 includes a release sheet 15 and when mounting the element body 12 on a substrate 16, the release sheet 15 is separated to achieve conductive connection between the conductive plate 14 and an external electrode 17 provided on the substrate 16. |
申请公布号 |
JP2014060319(A) |
申请公布日期 |
2014.04.03 |
申请号 |
JP20120205447 |
申请日期 |
2012.09.19 |
申请人 |
CITIZEN ELECTRONICS CO LTD;CITIZEN HOLDINGS CO LTD |
发明人 |
IINO TAKASHI;MIYASHITA JUNJI |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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