发明名称 SEMICONDUCTOR ELEMENT AND MOUNTING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor element equipped with a conductive plate for achieving electrical connection with an element electrode and an external electrode on a substrate side simply and with high accuracy.SOLUTION: A semiconductor element comprises: an element body 12; an element electrode 13 provided on an undersurface of the element body 12; and a conductive plate 14 joined to the element electrode 13. The conductive plate 14 includes a release sheet 15 and when mounting the element body 12 on a substrate 16, the release sheet 15 is separated to achieve conductive connection between the conductive plate 14 and an external electrode 17 provided on the substrate 16.
申请公布号 JP2014060319(A) 申请公布日期 2014.04.03
申请号 JP20120205447 申请日期 2012.09.19
申请人 CITIZEN ELECTRONICS CO LTD;CITIZEN HOLDINGS CO LTD 发明人 IINO TAKASHI;MIYASHITA JUNJI
分类号 H01L21/60 主分类号 H01L21/60
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