| 摘要 |
The present invention relates to a chip package substrate and a manufacturing method thereof. The chip package substrate according to an embodiment of the present invention includes an insulating layer; and a metal layer directly formed in the insulating layer. According to the embodiment of the present invention, the metal layer includes a first metal layer which is formed in the upper surface of the insulating layer; and a second metal layer which is formed in the lower surface of the insulating layer. [Reference numerals] (10) First coating layer; (20,40) Adhesive layer; (30) Insulating layer; (50) Second coating layer |
