| 摘要 |
<p>A wireless-communications-tower component being at least partially formed from a microsphere-filled metal. The microsphere-filled metal has a density of less than 2.7 g/cm3, a thermal conductivity greater than 1 W/m·K, and a coefficient of thermal expansion of less than 30 µm/m·K. Microspheres suitable for use in such microsphere-filled metal include, for example, glass microspheres, mullite microspheres, alumina microspheres, alumino-silicate microspheres, ceramic microspheres, silica-carbon microspheres, carbon microspheres, and mixtures of two or more thereof.</p> |
