发明名称 THERMAL ELECTROMAGNETIC WAVE DETECTION ELEMENT CHIP AND THERMAL ELECTROMAGNETIC WAVE DETECTOR, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a thermal electromagnetic wave detection element chip capable of preventing cracks from occurring between a main body and end portion of an arm piece even when the contour of the arm piece is reduced.SOLUTION: A support plate is disposed being faced to a base member being interposed by a space layer. The thermal electromagnetic wave detection element is supported on the support plate. An arm piece 29 extends from the support plate. An end portion 31 of the arm piece 29 is supported on the top surface of a support post 41. A reinforcement part 52 is formed integrally with a curved contour 53 so as to continue to a contour 51 of the end portion 31 which extends along the contour of support post 41 in plan view. A sharp V-like shape is avoided to be formed. Thus, even when the support plate is curled, generation of cracks can be prevented from being generated between the main body 29a and the end portion 31.
申请公布号 JP2014059249(A) 申请公布日期 2014.04.03
申请号 JP20120205345 申请日期 2012.09.19
申请人 SEIKO EPSON CORP 发明人 TSUCHIYA YASUSHI
分类号 G01J1/02;B81B7/02;G01J5/48;H01L37/02;H04N5/33 主分类号 G01J1/02
代理机构 代理人
主权项
地址