| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology of limiting influence due to heat generation by a semiconductor element on another electronic component.SOLUTION: A semiconductor unit 100 disclosed in the present specification comprises: heat transfer plates 24 for transferring heat of bus bars 32-34 to cooling plates 2, which extend from the cooling plates 2, respectively, and have ends 24a attached to the bus bars 32-34 outside a semiconductor module 3. With this configuration, since heat due to heat generation by a switching element 31 is transferred from the bus bars 32-34 to the cooling plate 2 via the heat transfer plate 24, influence due to the heat generation by the switching element 31 is unlikely to affect the electronic component such as a current sensor connected to the bus bars 32-34. Accordingly, influence due to heat generation by the switching element 31 on the other electronic component such as the current sensor 41 is limited. |
