| 摘要 |
PROBLEM TO BE SOLVED: To obtain a compact and inexpensive housing in which waterproof performance between a case and a cover constituting the housing, for housing a circuit board hermetically, is enhanced.SOLUTION: An outer peripheral groove 27A to be filled with a sealant 28 and an opposite surface 37 are provided at the mating part F on the case 20A side, and a tray 35 facing the opposite surface 37 and an outer peripheral protrusion 32A entering the outer peripheral groove 27A are provided at the mating part F on the cover 30A side. Parent size of each part is determined so that the outer gap A0 between the inner wall surface on the outside of the outer peripheral groove 27A and the outer wall surface of the outer peripheral protrusion 32A is always larger than the inner gap C0 between the inner wall surface on the inside of the outer peripheral groove 27A and the inner wall surface of the outer peripheral protrusion 32A, when the center positions of the case 20A and the cover 30A match each other. Even if the size of each part varies, the outer gap A never go to zero, and waterproofness on the outer wall surface of the cover is ensured. Thickness of the outer wall of the outer peripheral groove is suppressed and thereby the projection area of the case can be reduced. |
