发明名称 ELECTROLESS PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroless plating method which enables deposition of an electroless plating film with good adhesion.SOLUTION: An electroless plating method includes a step of irradiating a substrate 10 composed of resin with ultraviolet rays, a first catalyst step of making a first catalyst adhere to the substrate 10 by a first method, a second catalyst step of making a second catalyst adhere to the substrate 10 by a second method different from the first method, and a step of performing electroless plating for the substrate 10.
申请公布号 JP2014058700(A) 申请公布日期 2014.04.03
申请号 JP20120202781 申请日期 2012.09.14
申请人 KANTO GAKUIN 发明人 IIMORI YOSUKE;TAKAYAMA MASATOSHI;HONMA HIDEO
分类号 C23C18/20;C23C18/24;C23C18/28 主分类号 C23C18/20
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