发明名称 |
ALIGNMENT MEASUREMENT SYSTEM, OVERLAY MEASUREMENT SYSTEM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
According to one embodiment, an alignment measurement system is configured to measure a position of a mark having the highest identifiability of a plurality of marks formed in a substrate. The plurality of marks are made of mutually different patterns. A device pattern is formed in the substrate using directed self-assembly after the plurality of marks is formed. |
申请公布号 |
US2014094015(A1) |
申请公布日期 |
2014.04.03 |
申请号 |
US201313771968 |
申请日期 |
2013.02.20 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KASA KENTARO;TAKAKUWA MANABU;SUZUKI MASATO;KINOSHITA SHIZUO |
分类号 |
H01L21/66;G01B11/26 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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