NORMAL TEMPERATURE BONDING DEVICE AND NORMAL TEMPERATURE BONDING METHOD

摘要

A normal temperature bonding device is provided with a first beam source, a second beam source, and a pressure welding mechanism. The first beam source outputs a first activation beam that irradiates a first surface of a first substrate, and independently thereof, the second beam source outputs a second activation beam that irradiates a second surface of a second substrate. The pressure welding mechanism joins the first substrate and the second substrate by contact between the first surface and the second surface after the first activation beam has irradiated the first surface and the second activation beam has irradiated the second surface. Thus, a plurality of substrates of different materials is appropriately joined.