HEATING DEVICE, SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To improve in-plane temperature uniformity when processing a substrate by heating.SOLUTION: A heating device comprises: a plurality of lamp control parts; lamps connected to the lamp control parts, respectively; a power source for supplying power to the lamps through the lamp control parts; and a lamp arrangement part for arranging the lamps in a manner such that each lamp among the lamps lies adjacent to the lamp of the different lamp control part.