METHODS FOR WAFER BONDING, AND FOR NUCLEATING BONDING NANOPHASES
摘要
Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly; and compressing the assembly in the presence of an oxidizing atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
申请公布号
WO2014052476(A2)
申请公布日期
2014.04.03
申请号
WO2013US61722
申请日期
2013.09.25
申请人
ARIZONA BOARD OF REGENTS, A BODY CORPORATE OF THESTATE OF ARIZONA, ACTING FOR AND ON...
发明人
HERBOTS, NICHOLE;BENNETT-KENNETT, ROSS;MURPHY, ASHLEE;HUGHES, BRETT;ACHARYA, AJJYA;WATSON, CLARIZZA;CULBERTSON, ROBERT