| 摘要 |
A wiring pattern formation and a method for forming a wiring pattern characterized in that a first, second, and third step are performed in sequence. The first step is a step for laminating a resist layer (200) on a non-wired section (104) of a first surface (101) of an insulating substrate (100), the second step is a step for laminating an electroconductive thin film layer (300) on a wiring section (103) and at least part of the resist layer (200), and the third step is a step for radiating flash light (401) in the visible light band from a flash bulb (400) onto a second surface (202) of the resist layer (200) from a second surface (102) of the insulating substrate (100), dissolving the resist layer (200), and forming a wiring pattern made of the electroconductive thin film layer (300) on the wiring section (103). Provided is a new method for forming a wiring pattern which does not require complex steps such as using chemical substances such as etching liquids or resist peeling liquids, and which is environmentally and economically effective. |
