发明名称 ADHESION DEVICE, AND ADHESION METHOD
摘要 An adhesion device (1) for adhering a substrate (2) and a support body (3) via an adhesion layer (4) is provided with support body holding members (42). Holding tools (42a) of the support body holding members (42) hold the support body (3) with the oblique surface parts (contact members (42b)) of the holding tools (42a) in a manner such that the support body (3) does not come into contact with the surface of the substrate (2) to which the support body (3) is to be adhered. The adhesion device (1) adheres, to the substrate (2), the support body (3) that is held so as to not come into contact with the surface.
申请公布号 WO2014050484(A1) 申请公布日期 2014.04.03
申请号 WO2013JP73936 申请日期 2013.09.05
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 INAO, YOSHIHIRO;KATO, SHIGERU;TSUSHIMA, SHUGO;KATSURAGAWA, JUNICHI;KOBARI, SATOSHI;NAKAMURA, AKIHIKO
分类号 H01L21/02;H01L21/683 主分类号 H01L21/02
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