| 摘要 |
(Objective) The objective is to sever a ceramic substrate laminated with a metal film. (Instruments for solution) A first scribe line S1 is formed along a potentially scribed line using a patterning tool. Thereafter, by a scribing device, a second scribe line S2 is formed on the same position corresponding to the first scribe line S1 on the metal film (12). The respective scribe lines S1, and S2 are conducted with a breaking process from the side of the metal film (12) of the ceramic substrate (11). Therefore, the laminated ceramic substrate can be completely severed. |
