SEPARATION METHOD OF PCB FIXED FIN

摘要

The present invention relates to a separation method of a substrate reference pin forcibly pressed when processing a substrate reference hole and, more specifically, to a separation method of a substrate reference pin to rapidly separate the reference pin forcibly pressed to process a hole on the surface of a substrate without a separate equipment. The present invention comprises: a step of forming a reference hole using a drill combined with a spindle in a substrate manufacturing process; a step of pressing the reference pin into the reference hole; a step of chucking a depinning jig to the spindle after pressing the reference pin; a step of moving the spindle to the position where the reference pin is pressed; a step of removing the reference pin using the depinning jig by lowering the spindle; and a step of moving the removed reference pin to a pin collection box through a guide hose. [Reference numerals] (S1) Step of forming a reference hole using a drill combined with a spindle in a substrate manufacturing process; (S2) Step of pressing the reference pin into the reference hole; (S3) Step of chucking a depinning jig to the spindle after pressing the reference pin; (S4) Step of moving the spindle to the position where the reference pin is pressed; (S5) Step of removing the reference pin using the depinning jig by lowering the spindle; (S6) Step of moving the removed reference pin to a pin collection box through a guide hose