| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin, a photosensitive element, a permanent mask resist and a production method of the permanent mask resist, having sufficient characteristics required for a permanent mask resist (solder resist), as well as having excellent flexibility (flexibility and reduction in warpage and repulsion force) and low tackiness.SOLUTION: The photosensitive resin composition comprises: (A) a polyurethane compound; (B) a polymerizable compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; (D) a phosphorus-containing compound; and (E) a thermosetting agent. The (B) component includes, with respect to the total sum of the (A) to (E) components, 10 to 25 mass% of a reaction product of a polyhydric alcohol, a diisocyanate compound, a lactone compound and a (meth)acrylate compound having a hydroxyl group, and 3 to 10 mass% of a reaction product of a compound expressed by general formula (V) described below and a compound expressed by general formula (VI) described below. |
