| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved apparatus and method for performing measurement of a wafer.SOLUTION: The apparatus may include a substrate with a plurality of microprobes. A plurality of light sources may direct light onto each of the microprobes. Light reflected from the microprobes may be detected by a plurality of photodetectors, thereby detection signals each of which is associated with one of the microprobes are generated. A controller may send a driving signal to each of the plurality of microprobes, and may determine a height distribution and a surface charge distribution of the wafer on the basis of the detection signals. |
