COMPOSITE RESIN COMPOSITION FOR ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOLDED FROM COMPOSITE RESIN COMPOSITION

摘要

The objective of the present invention is to provide a composite resin composition for electronic components which has excellent fluidity and an electronic component molded from the composite resin composition. The present invention provides a composite resin composition for electronic components comprising (A) a liquid crystal polymer, (B) milled fiber and (C) a plate-like inorganic filler, wherein (A) the liquid crystal polymer includes, as essential components, (I) a constitutional unit derived from a 4-hydroxybenzoic acid, (II) a constitutional unit derived from a 2-hydroxy-6-naphthoic acid, (III) a constitutional unit derived from a terephthalic acid, (IV) a constitutional unit derived from an isophthalic acid and (V) a constitutional unit derived from a 4,4'-dihydroxybiphenyl.