| 摘要 |
PURPOSE: A substrate hardening system and a hardening method thereof are provided to improve productivity according to a hardening process. CONSTITUTION: A thin film transistor substrate and a color filter substrate are bonded in a bonding chamber(100). A bonded substrate is moved through a buffer chamber(500). A transfer robot(300) moves the bonded substrate to the buffer chamber in the bonding chamber. A first hardening unit(200) is installed on a path in which the bonded substrate is moved from the bonding chamber by using the transfer robot. A second hardening unit(400) is installed on a path in which the bonded substrate is inserted into the buffer chamber by using the transfer robot. |
